CMOS Hotplate Chemical Microsensors by Dr. Markus Graf, Dr. Diego Barrettino, Prof. Dr. Henry P.

By Dr. Markus Graf, Dr. Diego Barrettino, Prof. Dr. Henry P. Baltes, Prof. Dr. Andreas Hierlemann (auth.)

This is the 1st finished booklet on microhotplate-based chemical sensor platforms in CMOS-technology. It covers all elements of profitable sensor prototyping: conception of transducer modelling, microelectronics layout concerns, process layout concerns, and concerns with regards to method and machine microfabrication, packaging, and checking out. a number of various hotplates for various operation stipulations is distinctive and a kinfolk of metal-oxide-covered microhotplate-based microsensor structures with expanding complexity is gifted. those structures belong to a brand new new release of chemical microsensors and symbolize examples of the winning integration of nanomaterials, microtechnology and microelectronics.

The e-book presents scholars, scientists and engineers with an available advent to the sector of microhotplate-based chemical sensing, with all of the invaluable basic wisdom incorporated. past that, it additionally presents distinctive info on all vital matters referring to complicated high-performance CMOS chemical microsensor structures; consequently it is going to even be precious to specialists already conversant in the field.

Show description

Read or Download CMOS Hotplate Chemical Microsensors PDF

Best chemical books

Fractals, Diffusion, and Relaxation in Disordered Complex Systems: Advances in Chemical Physics, Part B, Volume 133

Fractals, Diffusion and rest in Disordered complicated platforms is a distinct guest-edited, two-part quantity of Advances in Chemical Physics that keeps to document fresh advances with major, up to date chapters by way of across the world well-known researchers. content material: bankruptcy 6 Fractal body structure, Complexity, and the Fractional Calculus (pages 1–92): Bruce J.

Signal Transduction by Reactive Oxygen and Nitrogen Species: Pathways and Chemical Principles

Henry Jay Forman, Jon Fukuto and Martine Torres "Research is to determine what every person else has noticeable and to imagine what no one else has suggestion. " -- Albert Szent-Gyorgyi a number of years in the past, one in all us prepare a ebook that handled a variety of facets of oxidative pressure and brought the concept that of sign transduction via oxidants.

Additional resources for CMOS Hotplate Chemical Microsensors

Sample text

34) T The considerations so far rely on constant heating power, and the way how this power is applied to the microhotplate does not play a role. In fact, a monolithically integrated control circuitry does not apply constant power but acts as an adjustable current source. Moreover, for measuring the thermal time constant experimentally, either a rectangular voltage or rectangular current pulse is applied. 5 AHDL-Model for System Simulations 27 differs from the “real” thermal time constant as defined by Eqs.

4 summarizes the design parameters. The Pt-resistor was connected in a 4-point configuration with the Pt-Al-contacts located on the bulk silicon. An additional poly-Si temperature sensor was integrated underneath the Pt-resistor, which can be used as a reference. The heater is still fabricated in polysilicon, but the design was modified in order to avoid Al-contacts in the heated area. The heater has a nominal resistance of  Ω and was, again, realized in a parallel configuration. The contact of the polysilicon to the metallization is not located in the heated area, but at a certain distance from the heated area on the membrane.

The thermal time constant was calculated from these data with a curve fit using Eq. 29). As already mentioned in the context of Eq. 37), self-heating occurs with a resistive heater, so that the thermal time constant has to be determined during the cooling cycle. 4 Calibration of the Temperature Sensors The discrete microhotplates were packaged and bonded in a DIL-28 package for temperature sensor calibration. A Pt-100-temperature sensor was attached to the chip package in close vicinity to the sensors.

Download PDF sample

Rated 4.93 of 5 – based on 11 votes